Router-in-a-Package Design Combining HBM4, Chiplets and In-Package Optics (Technion, Berkeley, UCSD)
A new technical paper “Scaling Routers with In-Package Optics and High-Bandwidth Memories” was posted by researchers at Technion, UC Berkeley and UC San Diego. Abstract “This paper aims to apply two major scaling transformations from the computing packaging industry to internet routers: the heteroge...